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| DATA SHEET PHOTO COUPLERS PS2631, PS2631L HIGH COLLECTOR VOLTAGE 6PIN PHOTO COUPLER DESCRIPTION PS2631, PS2631L are optically coupled isolators containing a GaAs light emitting diode and a silicon photo transistor. PS2631 is in a plastic DIP (Dual In-line Package). PS2631L is lead bending type (Gull-wing) for surface mount. FEATURES * High input to output isolation voltage. (BV: 5 kVr.m.s. MIN.) * High collector to emitter voltage (VCEO). (VCEO: 200 V MIN.) * High speed switching (tr, tf = 10 s TYP.) * UL recognized [File No. E72422 (S)] * Taping Product number (PS2631L-E3, E4) APPLICATIONS Interface circuit for various instrumentations, control equipments. * AC Line/Digital Logic ************************************************** Isolate high voltage transient * Digital Logic/Digital Logic ******************************************* Eliminate spurious ground loops * Twisted Pair line receiver ******************************************* Eliminate ground loop pick-up * Telephone/Telegraph line receiver **************************** Isolate high voltage transient * High Frequency Power Supply Feedback Control **** Maintain floating ground Document No. P11436EJ2V0DS00 (2nd editon) (Previous No. LC-2261) Date Published June 1996 P Printed in Japan (c) 1990 PS2631, PS2631L PACKEGE DIMENSIONS (Unit: mm) DIP (Dual In-line Package) PS2631 Lead Bending type (Gull-wing) PS2631L 10.16 MAX. 6 4 10.16 MAX. 6 4 3.8 MAX. 1 3 0.05 to 0.2 7.62 6.5 3.8 MAX. 1 3 7.62 6.5 2.8 MIN. 4.55 MAX. 1.34 2.54 0.50 0.10 2.54 MAX. 0.25 M 2.54 1.34 0.10 0 to 15 2.54 MAX. 0.25 M 0.65 0.9 0.25 9.60 0.4 PIN CONNECTION (Top View) PS2631, PS2631L 6 5 4 1. Anode 2. Cathode 3. NC 4. Emitter 5. Collector 6. Base 1 2 3 2 PS2631, PS2631L ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Diode Reverse Voltage Forward Current Power Dissipation Temperature Coefficient Power Dissipation Transistor Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Temperature Coefficient Power Dissipation Isolation Voltage*1) Storage Temperature Operating Temperature VR IF PD/C PD VCEO VECO IC PC/C PC BV Tstg Topt 6 80 1.5 150 200 6 50 3.0 300 5 000 -55 to +150 -55 to +100 V mA mW/C mW V V mA mW/C mW Vac C C *1) AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output. ELECTRICAL CHARACTERISTICS (TA = 25 C) CHARACTERISTIC Diode Forward Voltage Reverse Current Capacitance Transistor Collector to Emitter Dark Current DC Current Gain Coupled Current Transfer Ratio*2) SYMBOL VF IR Ct ICEO hFE CTR (IC/IF) VCE(sat) R1-2 C1-2 tr tf 1011 0.5 10 10 50 300 280 0.25 % V pF 50 200 MIN. TYP. 1.1 MAX. 1.4 5 UNIT V TEST CONDITIONS IF = 10 mA VR = 5 V V = 0, f = 1.0 MHz VCE = 200 V, IF = 0 IC = 2 mA, VCE = 5.0 V IF = 5 mA, VCE = 5.0 V IF = 10 mA, IC = 2.0 mA Vin-out = 1.0 kV V = 0, f = 1.0 MHz VCC = 5 V, IF = 10 mA, RL = 1 k VCC = 5 V, IF = 10 mA, RL = 1 k A pF nA Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Fall Time*3) s s Time*3) *2) CTR rank (%) K : 130 to 280 L : 80 to 150 M : 50 to 100 *3) Test Circuit for Switching Time Pulse input Pulse width = 100 s Duty cycle = 1/10 IF 50 VOUT VCC = 5 V RL = 1 k 3 PS2631, PS2631L TYPICAL CHARACTERISTICS (TA = 25 C) FORWARD CURRENT vs. FORWARD VOLTAGE 100 50 60 80 mA 60 mA 50 mA 40 mA 30 mA 30 20 mA 15 mA 10 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE 10000 1.6 NORMALIZED OUTPUT CURRENT vs. AMBIENT TEMPERATURE 10 mA IF = 5 mA 5 10 20 25 15 Collector to Emitter Voltage VCE (V) 30 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE Forward Current IF (mA) 10 5 Collector Current ICE (mA) CTR (Relative Value) 100 C 60 C 25 C 0 C -25 C -55 C 50 40 1 0.5 20 0.1 Forward Voltage VF (V) Collector Cutoff Current ICEO (nA) 1000 1.4 40 V 100 VCE = 200 V 10 1 -50 -25 0 Ambient Temperature TA (C) CURRENT TRANSFER RATIO (CTR) vs. FORWARD CURRENT VCE = 5 V 240 220 200 180 160 140 120 100 80 60 40 20 0.1 1.0 CTR (Relative Value) CTR (%) CTR = 200% CTR = 190 % CTR = 120 % 0.5 1.0 IF (mA) 4 ,, ,, 20 V 10 V 1.2 1.0 0.8 0.6 0.4 0.2 Normalized to 1.0 at TA = 25 C IF = 5 mA VCE = 5 V 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature TA (C) NORMALIZED OUTPUT CURRENT vs. BASE RESISTANCE 20 mA 0.8 0.6 10 mA 0.4 0.2 IF = 5 mA CTR = 60% 5.0 10 50 100 50 k 100 k 500 k 1 M Base to Emitter Resistance RB () PS2631, PS2631L DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 150 300 TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 100 Power Dissipation PC (mW) Power Dissipation PD (mW) 1.5 mW/C 200 3.0 mW/C 50 100 0 25 50 75 100 125 150 0 25 50 75 100 125 150 Ambient Temperature TA (C) SWITCHING TIME vs. LOAD RESISTANCE 1000 IF = 10 mA VCC = 5 V 50 Ambient Temperature TA (C) COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 80 mA 40 mA tf 100 ts 10 20 mA 10 mA Switching Time ( s) Collector Current IC (mA) 5 IF = 5 mA 10 td tr 1 1.0 0.5 1 5 10 50 100 0.1 0 0.2 0.4 0.6 0.8 1.0 Collector Saturation Voltage VCE (sat) (V) Load Resistance RL (k) FREQUENCY RESPONSE 1.0 Relative Output A 0.8 RL = 100 0.6 0.4 0.2 0 500 1 k 5 k 10 k Frequency (Hz) 50 k 100 k 500 k RL = 1 k 5 PS2631, PS2631L NOTES AT MOUNTING (1) NOTES AT MOUNTING BY INFRARED REFLOW SOLDERING * Peak temperature * Time * Flux : : : 235 C or less (resin surface temperature) Within 30 sec. (timing during which resin surface temperature is 210 C or more) Three Rosin flux with little chlorine is recommended. Reflow Temperature Profile * Number of times of reflow : (ACTUAL HEAT) to 10 s Resin surface temperature (C) 235 C MAX. 210 C to 30 s 120 to 160 C 60 to 90 s Time (s) Peak Temperature 235 C or Lower (2) NOTES AT MOUNTING BY DIP SOLDERING * Temperature : 260 C or less * Time * Flux : Within 10 sec. : Rosin flux with little chlorine is recommended. 6 PS2631, PS2631L [MEMO] 7 PS2631, PS2631L Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the Japanese law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 12 |
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